Flow stress/strain rate/grain size coupling for fcc nanopolycrystals |
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Authors: | R W Armstrong P Rodriguez |
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Institution: | 1. University of Maryland , College Park , MD 20742 , USA rona@eng.umd.edu;3. Indian Institute of Technology , Madras, Chennai 600 036 , India |
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Abstract: | A Hall–Petch (H–P)-type dependence is demonstrated for reciprocal activation volume measurements for nanocrystalline and conventional grain size, strengthened Ni and Cu materials, consistent with predictions derived from the dislocation pile-up model. The observed H–P dependence indicates that the shear stress for cross-slip must be involved in the full grain size regime for transmission of plastic flow at the grain boundaries of fcc metals. |
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