| Bi-2223复合导体直流磁场下自场损耗热稳定性分析 |
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| 引用本文： | 赵炯,汪良斌.Bi-2223复合导体直流磁场下自场损耗热稳定性分析[J].低温与超导,2012(11):29-32,84. |
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| 作者姓名： | 赵炯 汪良斌 |
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| 作者单位： | 中国科学院合肥物质科学研究院等离子体物理研究所 |
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| 摘 要： | 对于一种Bi-2223的复合导体,利用ANSYS软件,我们分析了在直流磁场下励磁过程中,自场损耗对复合导体热稳定性的影响;然后假定Bi-2223超导带内不同的损耗值,通过计算,确定了达到超导带分流温度的最小损耗值。
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| 关 键 词： | Bi-2223复合导体 自场损耗 热稳定性 |
Thermal stability analysis of Bi-2223 composite conductor with self-field loss subject to DC magnetic field |
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| Zhao Jiong,Wang Liangbin.Thermal stability analysis of Bi-2223 composite conductor with self-field loss subject to DC magnetic field[J].Cryogenics and Superconductivity,2012(11):29-32,84. |
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| Authors: | Zhao Jiong Wang Liangbin |
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| Institution: | (Institute of Plasma Physics,Chinese Academy of Sciences,Hefei 230031,China) |
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| Abstract: | For one kind of Bi-2223 composite conductor,we analyzed the influence of self-field loss subject to DC magnetic field on the thermal stability of this composite conductor during charging period with ANSYS software.Assuming different losses in Bi-2223 tapes,we found the minimum loss which caused superconducting tape to reach its current sharing temperature. |
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| Keywords: | Bi-2223 composite conductor Self-field loss Thermal stability |
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