| 集成电路封装用绝缘胶漏电失效分析 |
| |
| 引用本文： | 黄炜,付晓君,徐青.集成电路封装用绝缘胶漏电失效分析[J].微电子学,2017,47(4):590-592. |
| |
| 作者姓名： | 黄炜 付晓君 徐青 |
| |
| 作者单位： | 中国电子科技集团公司 第二十四研究所, 重庆 400060,中国电子科技集团公司 第二十四研究所, 重庆 400060,中国电子科技集团公司 第二十四研究所, 重庆 400060 |
| |
| 摘 要： | 在电子元器件封装领域中,塑封器件正逐步替代气密性封装器件。目前工业级塑封器件已不能满足器件的高可靠性要求,工业级塑封器件在严酷的环境应力试验中经常出现失效。研究了工业级塑封器件在可靠性筛选试验中出现失效的问题,通过X射线观察和芯片切面分析等方法,查明了造成器件失效的原因,并提出了优化改进措施。
|
| 关 键 词： | 塑封器件 绝缘胶 漏电失效 失效分析 |
| 收稿时间： | 2016/8/7 0:00:00 |
Analysis of Leakage Failure of Insulation Adhesive in IC Package |
| |
| HUANG Wei,FU Xiaojun and XU Qin.Analysis of Leakage Failure of Insulation Adhesive in IC Package[J].Microelectronics,2017,47(4):590-592. |
| |
| Authors: | HUANG Wei FU Xiaojun and XU Qin |
| |
| Institution: | Sichuan Institute of Solid-State Circuits, China Electronics Technology Group Corp., Chongqing 400060, P. R. China,Sichuan Institute of Solid-State Circuits, China Electronics Technology Group Corp., Chongqing 400060, P. R. China and Sichuan Institute of Solid-State Circuits, China Electronics Technology Group Corp., Chongqing 400060, P. R. China |
| |
| Abstract: | Hermetic encapsulated devices were gradually replaced by plastic encapsulated devices in the field of electronic packaging. But the current industrial-grade encapsulated devices could not meet the requirement of high reliability. The industrial-grade plastic encapsulated devices often failed in harsh environmental stress tests. In the reliability screening test, the failures of industrial-grade encapsulated devices were studied. The reasons of failure were found out by means of X-ray observation and chip section analysis, and the optimization and improvement measures were put forward. |
| |
| Keywords: | Plastic encapsulated device Insulating adhesive Leakage failure Failure analysis |
|
| 点击此处可从《微电子学》浏览原始摘要信息 |
| 点击此处可从《微电子学》下载免费的PDF全文 |
|
