热电式MEMS微波功率传感器的优化设计

为了提高热电式微波功率传感器的传热效率,改善传感器的性能,对热电式微波功率传感器的衬底结构进行了优化设计,得到了最优的衬底结构尺寸。首先研究衬底厚度对热电式微波功率传感器的影响,然后根据得到的最优衬底厚度,研究基底膜位置及尺寸对热电式微波功率传感器性能的影响,最后对所得最优衬底结构传感器的微波特性以及电磁场分布进行研究。结果表明,当传感器衬底的结构尺寸最优时,传感器的最高温度达到352.76 K,S参数小于-20.62 dB。该结构不仅减少了热量在衬底的堆积,提高了负载电阻到热电堆的热传输效率,而且具有良好的微波特性。

Optimization Design of Thermoelectric MEMS Microwave Power Sensors

In order to improve the heat transfer efficiency and the performance of the thermoelectric microwave power sensors, the substrate structure of the thermoelectric microwave power sensors was optimized, and the optimal substrate structure size was obtained in this work. Firstly, the influence of substrate thickness on thermoelectric microwave power sensors was studied. Then, according to the obtained optimal substrate thickness, the effects of substrate position and size on the performance of thermoelectric microwave power sensor were studied. Finally, the microwave characteristics and electromagnetic field distribution of the sensor with the optimal substrate structure were studied. The results show that when the structure size of the sensor substrate is optimal, the maximum temperature of the sensor reaches 352.76 K and the S parameter is less than -20.62 dB. The structure not only reduces the heat dissipation in the substrate and improves the heat transfer efficiency from the load resistance to the thermopile, but also has good microwave characteristics.