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Annealing effects on zirconium nitride films
Authors:H. B. Bhuvaneswari   V. Rajagopal Reddy   R. Chandramani  G. Mohan Rao  
Affiliation:

a Department of Instrumentation, Indian Institute of Science, Bangalore 560012, India

b Mysore University, PG Centre, Hassan, India

c Bangalore University, Bangalore, India

Abstract:ZrN films were deposited by dc reactive magnetron sputtering on silicon substrates under optimized nitrogen partial pressure of 6×10−5 mbar. Structural, electrical and optical properties were systematically investigated. Films deposited at room temperature exhibited Schottky structure without any silicide interfacial layer. These films have electrical resistivity of 4.23×10−3 Ω cm, which were crystalline in nature, with cubic (1 1 1) orientation. Refractive index and extinction coefficient were found to be 1.95 and 0.43, respectively at a wavelength of 350 nm.

Samples were annealed for 1 h in air at two temperatures, 350 and 550 °C. Scanning electron microscopy (SEM) and energy dispersive analysis of X-rays (EDAX) showed alloy penetration pits. Extent of penetration was greater in the films, which were annealed at higher temperature (550 °C). Variation in refractive index was observed in the range of 1.95–1.80 at 350 nm, for the annealed films, with increase in grain size from 7.25 to 11.10 nm. Poly-crystalline nature has been observed with (1 1 1) and (2 0 1) orientations. Resistivity is found to increase from 4.23×10−3 to 6.21×10−3 Ω cm.

Keywords:Sputtering   Pits formation   Nano-particles   Schottky devices   Resistivity   Annealing
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