对角线六边形的TSV冗余结构设计

硅通孔(TSV)在制造过程中容易产生各类故障缺陷,导致3D芯片合格率降低。为了解决这一问题,提出一种新的对角线六边形冗余结构,对均匀故障的修复率保持在99%以上,对聚簇故障的修复率与路由冗余结构相近,并高于环形冗余结构。实验结果表明,与环形和路由冗余结构相比,该结构的面积开销分别减小了1.64%和72.99%,修复路径长度分别降低了39.4%和30.81%;与路由结构相比,该结构的时间开销缩短了62.55%。

Design of TSV Redundant Structure with Diagonal Hexagonal Shape

Vertical interconnection of 3D chips via through-silicon via (TSV) was considered to be a great boost to the semiconductor industry, but TSV was prone to various kinds of faults during manufacturing, which led to the reduction of the yield of 3D chips. To solve this problem, a novel diagonal hexagonal redundancy structure was proposed to repair the TSV fault. The experimental results showed that the repair rate for uniform faults was always above 99%, while the repair rate for clustered fault was similar to that of router-based structure and higher than that of ring-based structure. In addition, the area overhead was reduced by 1.64% and 72.99% compared with that of the ring-based and router-based structure, respectively. In terms of time overhead, this structure was shortened by 62.55% compared with the router-based structure. The repair path length of this structure was 30.81% and 39.4% lower than that of router-based and ring-based structure, respectively.