| 基于mini-bar的二极管激光器焊接实验研究 |
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| 引用本文： | 王昭,雷军,谭昊,高松信,武德勇.基于mini-bar的二极管激光器焊接实验研究[J].强激光与粒子束,2016,28(8):081002. |
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| 作者姓名： | 王昭 雷军 谭昊 高松信 武德勇 |
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| 作者单位： | 1.中国工程物理研究院 应用电子学研究所, 四川 绵阳 621 900; |
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| 摘 要： | 半导体激光器封装工艺过程对于激光器的输出特性、寿命等性能有重要影响,其中焊料的选择和焊接工艺是最关键的因素。采用半自动焊接系统将mini-bar芯片通过In焊料直接焊接在Cu热沉上,并通过硬件改进、软件优化、放缓成像过程等措施实现了高精度、高可靠性的焊接。通过对激光器的性能测试发现,其焊接功率稳定,焊接精度均值可达20 m,smile效应值可以控制在0.5 m。
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| 关 键 词： | 二极管激光器 焊接 mini-bar 封装 |
| 收稿时间： | 2015-11-11 |
Experimental investigation on diode laser bonding based on mini-bars |
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| Institution: | 1.Institute of Applied Electronics,CAEP,P.O.Box 919-1015,Mianyang 621900,China;2.The Key Laboratory of Science and Technology on High Energy Laser,CAEP,P.O.Box 919-1015,Mianyang 621900,China |
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| Abstract: | Packaging technology for semiconductor laser diodes influences significantly on their output characteristics, such as lifetime. Selections of solders and welding process are very important. Using a semi-automatic welding system, mini-bar was directly welded on Cu heat sink with indium solder. By improving the welding system, optimizing software and slowing imaging procedures, the welding with high accuracy and high reliability was achieved. Measurements of the laser performances show that power for the welding is stable, its welded precision is 20 m, smile effect can be controlled less than 0.5 m. |
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