Thermostressed state of a piezoelectric bodywith a plane crack under symmetric thermal load |
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Authors: | V. S. Kirilyuk |
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Affiliation: | (1) S. P. Timoshenko Institute of Mechanics, National Academy of Sciences of Ukraine, Kyiv, Ukraine |
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Abstract: | The paper addresses a thermoelectroelastic problem for a piezoelectric body with an arbitrarily shaped plane crack in a plane perpendicular to the polarization axis under a symmetric thermal load. A relationship between the intensity factors for stress (SIF) and electric displacement (EDIF) in an infinite piezoceramic body with a crack under a thermal load and the SIF for a purely elastic body with a crack of the same shape under a mechanical load is established. This makes it possible to find the SIF and EDIF for an electroelastic material from the elastic solution without the need to solve specific problems of thermoelasticity. The SIF and EDIF for a piezoceramic body with an elliptic crack and linear distribution of temperature over the crack surface are found as an example __________ Translated from Prikladnaya Mekhanika, Vol. 44, No. 3, pp. 96–108, March 2008. |
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Keywords: | thermopiezoelectricity transversely isotropic material plane crack elliptic crack stress intensity factor electric displacement intensity factor |
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