Electronic speckle pattern interferometry deformation measurement on lightweight structures under thermal load |
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Authors: | Erwin Hack,Rolf Br nnimann |
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Affiliation: | EMPA Duebendorf, Section Electronics/Metrology, Ueberlandstrasse 129, CH-8600 Duebendorf, Switzerland |
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Abstract: | We report on the application of ESPI to measure deformations induced by thermal load on lightweight honeycomb panels for space applications. The panel was mounted isostatically onto a vibration isolated table. A housing for temperature stabilisation was constructed enclosing the panel, heating elements, fans and the ESPI-head made of Invar. Emphasis is put on the quantitative analysis of the deformation of this large object (0.8×0.8 m2) viewed from a relatively short distance of 1.1 m and illuminated sequentially from three non-orthogonal directions. Influences of laser stability, rigid body displacements, temperature inhomogeneities as well as possible deformations of the measurement head are discussed in order to derive the measurement uncertainty and to estimate corrections. Beside the sensitivity vector analysis it is important to take into account the optical light path changes due to temperature changes. Out-of-plane deformation fields of the panel are presented. |
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Keywords: | ESPI Interferometry 3D measurement Deformation measurement Measurement uncertainty Calibration |
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