New lead-containing solder alloy with improved properties

Structure, hardness, mechanical and electrical transport properties of the rapidly solidified Pb–25Sn alloy with Cd additions have been investigated. The results show that, a continuous increase in Cd content causes more precipitations of Cd as a third phase, which in turn causes continuous enhancement of the wetting, electrical and mechanical properties of this alloy. In spite of the higher value of TCR for the alloy Pb–25Sn–20Cd, it has the most enhanced properties when compared with the others. It has a lower electrical resistivity, lower wetting angle, higher Vickers microhardness values and yield strength when compared with the eutectic Pb–Sn solder alloy.