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玻璃上基于自组装和喷墨打印的选位金属沉积
引用本文:王金意,刘冉,蔡文斌.玻璃上基于自组装和喷墨打印的选位金属沉积[J].高等学校化学学报,2008,29(8):1644-1646.
作者姓名:王金意  刘冉  蔡文斌
作者单位:1. 复旦大学化学系,上海分子催化与功能材料重点实验室,上海,200433
2. 复旦大学微电子系,上海,200433
基金项目:国家自然科学基金,上海市纳米科技专项基金,中德IRTG项目
摘    要:采用氨基硅烷自组装分子对玻璃表面进行修饰; 借助喷墨打印技术, 按照设计好的线路图形把引发化学镀的催化剂“墨水”喷射在上述修饰表面上. 由于自组装分子具有朝向面外的氨基末端能吸附作为催化剂的溶胶或离子, 因而可以起到“有机浆糊”的作用, 使图形化的催化剂层固定在表面上以充当模板, 由于化学镀只在催化剂模板上发生, 从而可获得与设计一致的, 且与基底牢固结合的金属沉积图形. 将该方法拓展应用到玻璃基底上, 着重优化自组装条件, 提高了结合力, 首次实现了玻璃表面上包括金、铜以及镍硼合金在内的多种金属直接成型.

关 键 词:自组装  喷墨打印  选择性化学镀
收稿时间:2008-05-05

Selective Deposition of Metal Patterns on Glass Based on Self-assembly and Inkjet Printing
WANG Jin-Yi,LIU Ran,CAI Wen-Bin.Selective Deposition of Metal Patterns on Glass Based on Self-assembly and Inkjet Printing[J].Chemical Research In Chinese Universities,2008,29(8):1644-1646.
Authors:WANG Jin-Yi  LIU Ran  CAI Wen-Bin
Institution:Shanghai Key Laboratory for Molecular Catalysis and Innovation Material, Department of Chemistry, ;Department of Microelectronics, Fudan University, Shanghai 200433, China
Abstract:Selective metallization on glass is widely used in the production of printed circuit boards(PCB),display panels and solar cells. Selective masking and etching steps are used in the traditional photolithographic processes to create the regions of metallization on non-conducting substrates; however, these processes require high-cost facilities and complicated operations. To address these issues, a non-photolithographic process to form metal patterns on glass was proposed and put into practice, which combines self-assembly of aminosilane, desktop inkjet printing of a catalyst ink, and selective electroless plating of Au, Cu or Ni-B alloy on the catalyst template to form desired patterns with a minimal line width of about 200 μm. The adherence of the metal layer deposited on glass is significantly enhanced due to the surface modification of self-assembled aminosilane layer. The non-photolithographic approach could be cost-effective for prototype and small patch of production of metallic patterns, simple electric circuits and other electronic device parts.
Keywords:Self-assembly  Inkjet printing  Selective electroless plating
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