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A New 3D Digitizer by Cutting and Scanning Layer-by-layer
Authors:ZHOU Jian  YANG Yuxiao  ZHAO Mingtao  TAN Yushan
Abstract:A crucial element in the reverse engineering process is to obtain 3D data of the part or its CAD model. A new method is presented in this paper, which combines layer-by-layer cutting and scanning on each cross-section of a part with a milling machine and an image scanner respectively. The method can capture the internal and external profile informations of a complex-shaped part at the same precision simultaneously. When data files of 2D edges are imported into the 3D CAD/CAM package, the 3D data or 3D CAD model is acquired. According to the customers' requirements, the system can reach the highest accuracy of 5.4 μm, and a resolution of 2.7 μm in obtaining the 2D edges. The product is completely made now, on which experiments are conducted, which demonstrate the higher accuracy and efficiency.
Keywords:layer-by-layer 3D digitizer  reverse engineering  internal and external profile measurement  3D CAD model
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