Mode III fracture problem of a cracked FGPM surface layer bonded to a cracked FGPM substrate

This work deals with the mode III fracture problem of a cracked functionally graded piezoelectric surface layer bonded to a cracked functionally graded piezoelectric substrate. The cracks are normal to the interface and the electro-elastic material properties are assumed to be varied along the crack direction. Potential and flux types of boundary condition are assigned on the edge of the surface layer. The problem under the assumptions of impermeable and permeable cracks can be formulated to the standard singular integral equations, which are solved by using the Gauss–Chebyshev technique. The effects of the boundary conditions, the material properties and crack interaction on the stress and electric displacement intensity factors are discussed.