Optical interconnects: the challenge |
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| Institution: | 1. Graduate School of Engineering, Hokkaido University, Kita 13, Nishi 8, Kita-Ku, Sapporo, 060-8628, Japan;2. Faculty of Engineering, Hokkaido University, Kita 13, Nishi 8, Kita-Ku, Sapporo, 060-8628, Japan;1. Institute of Parasitology, University of Zurich, Winterthurerstrasse 266a, CH-8057 Zurich, Switzerland;2. Research School of Biology, Australian National University, Canberra, ACT 2601, Australia;1. Department of Structural and Geotechnical Engineering, Sapienza University of Rome, Italy;2. Department of Innovation Engineering, University of Salento, Lecce, Italy |
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| Abstract: | As the integrated circuit complexity and speed increase, interconnects become the main bottleneck in microelectronics processes for further improvements of the performances. Optics is considered as a possible alternative solution to meet the expected requirements, and has already proven its advantages for distances which progressively shorten from optical telecommunications towards inter-boards, and then interchip connections. This paper focuses on the potentialities of optical solutions for intrachip interconnects. |
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