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Optical inspection system with tunable exposure unit for micro-crack detection in solar wafers
Authors:Shun-Sheng Ko  Chien-Sheng Liu  Yang-Cheng Lin
Institution:1. Additive Manufacturing and Laser Application Center, Industrial Technology Research Institute, Tainan 734, Taiwan;2. Department of Mechanical Engineering, National Chung Cheng University, Chiayi County 62102, Taiwan;3. Advanced Institute of Manufacturing with High-tech Innovations, National Chung Cheng University, Chiayi County 62102, Taiwan
Abstract:Micro-cracks are a major cause of wafer breakage in the solar wafer manufacturing process. Furthermore, the existence of micro-cracks may lead to electrical failure in the post-fabrication inspection of solar cells and solar modules. Thus, the reliable detection of micro-cracks is an important concern in the photovoltaic industry. Accordingly, the present study proposes a novel micro-crack inspection system comprising a near infrared light source, a CCD camera and a tunable exposure unit. In the proposed system, the intensity of the light transmitted through the wafer is sensed by a photodetector and the exposure time of the CCD camera is tuned accordingly in order to maximize the contrast of the CCD image; thereby improving the performance of the crack detection process. The experimental results show that the proposed system enables the reliable detection of micro-cracks in solar wafers with a thickness of up to 240 μm within 1 s. In other words, the system provides an ideal solution for on-line micro-crack inspection applications in the photovoltaic industry.
Keywords:Micro-cracks  Defect  Inspection  Silicon wafer  Solar wafer
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