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Ceramic Substrates for High-temperature Electronic Integration |
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| Authors: | N Chasserio S Guillemet-Fritsch T Lebey and S Dagdag |
| Institution: | (1) Centre Inter-universitaire de Recherche et d’Ingénierie des Matériaux-CIRIMAT-Bat. 2R1, 118 Route de Narbonne, 31077 Toulouse Cedex 04, France;(2) Laboratoire LAPLACE, Université Paul Sabatier. Bat. 3R3, 118, Route de Narbonne, 31062 Toulouse Cedex 9, France;(3) Power Electronics Associated Research Laboratory, ALSTOM Transport, Rue du Docteur Guinier, 65 600 Semeac, France |
| Abstract: | One of the most attractive ways to increase power handling capacity in power modules is to increase the operating temperature using wide-band-gap semiconductors. Ceramics are ideal candidates for use as substrates in high-power high-temperature electronic devices. The present article aims to determine the most suitable ceramic material for this application. |
| Keywords: | High-temperature electronics passive component system integration packaging ceramic substrate |
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