| 浅谈带散热片产品的封装 |
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| 引用本文： | 王立国,慕向辉,李斌.浅谈带散热片产品的封装[J].中国集成电路,2012(8):63-66. |
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| 作者姓名： | 王立国 慕向辉 李斌 |
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| 作者单位： | 1. 天水华天科技股份有限公司,甘肃天水,741000
2. 华天科技西安有限公司,陕西西安,710018 |
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| 摘 要： | 带散热片封装的产品主要是功率器件，其产品在使用过程中会产生热能，主要借助散热片来释放，其产生的热能对散热片上的焊线质量提出了更大的挑战。带散热片封装的集成电路分为两种，一种是散热片上打线的集成电路，一种是散热片不打线的集成电路。本文主要讨论了对散热片打线集成电路的散热和工艺方面的改进。
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| 关 键 词： | 散热 封装 焊线方式 热传导 |
Discussion on the packaged products with heat sinks |
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| WANG Li-guo,MU Xiang-hui,Li Bin.Discussion on the packaged products with heat sinks[J].China Integrated Circuit,2012(8):63-66. |
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| Authors: | WANG Li-guo MU Xiang-hui Li Bin |
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| Institution: | 1 ( 1.Tianshui Huatian Technology Co.,LTD, Tianshui, 741000, China; 2. Huatian Technology Xian Co.,LTD, Xian, 710018, China) |
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| Abstract: | Products with a heat sink package are mainly power devices, and the heat is released mainly through the heat sink, so the heat dissipation brings a great challenge to the quality of the wires. IC package with a heat sink is divided into two types, the first type are wires bonded on the heat sink,the second type are wires not bonded on the heat sink. This article focuses on the improvement of the heat in the first type and the process in plastic IC package. |
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| Keywords: | heat dissiption package wire bonding thermal conduction |
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