Interfacial fracture analysis of a graded piezoelectric layer on a substrate with finite dimension |
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Authors: | Yong-Dong Li Kang Yong Lee |
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Institution: | (1) Center for Composite Materials and Structures, Harbin Institute of Technology, P. O. Box 3010, 150080 Harbin, People’s Republic of China |
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Abstract: | In fracture analysis of piezoelectric devices, the structural dimension is often assumed to be infinite at least in one direction.
However, all practical piezoelectric structures are finite and their dimensions in different directions are often comparable
and cannot be simplified as infinite. The assumption of infinite dimension may lead to inexact theoretical results. The present
work aims at studying the interfacial fracture behavior of a functionally graded piezoelectric layer on a dielectric substrate
with finite dimension. The crack problem is solved by the methods of Fourier series and Cauchy singular integral equation.
Parametric studies on the stress intensity factor (SIF) reveal the following: (a) when a crack tip is near to an interface
end, its SIF is mainly governed by the end effect; (b) when a crack is far from the interface ends and the piezoelectric layer
is thin, its SIF is principally affected by the thickness of the piezoelectric layer, and (c) only when a crack is far from
the interface ends and meanwhile the piezoelectric layer is thick will its SIF be dominated by the non-homogeneity parameter,
and in this case, the SIF increases with the increasing non-homogeneity parameter. |
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Keywords: | |
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