盲埋孔印刷板制作难度的测量方法探究

盲埋孔印制板产品因为其可实现高密度、小尺寸而成为目前印制板的主流产品之一,不仅普通刚性印制板有盲埋孔的设计,而且刚-挠印制板、挠性印制板、微波印制板(特种材料)、埋入电容印制板也采用了盲埋孔的设计,更有尖端的设计是在背板中加上了盲埋孔的设计,印制板的设计越来越复杂,业界人士对于如何划分盲埋孔印制板的难度存有许多困惑,汇总了各种具有复杂结构的盲埋孔印制板的例子,并给出了用数据量化制作难度的一些方法,供业界人员设计、报价及生产参考。

Blind and buried Via PCB manufacturing difficulty check method

Blind & Buried via design are popular applied in PCB currently due to high density and small dimension of the products is available,not only the normal rigid PCB,but also the rigid-flex PCB,flex PCB,micro-wave PCB,bury capacitor PCB,even the backplane designed with blind & buried via.How can we classify the difficulty of the more and more complex designed BVH PCBs,every people of PCB industry want to know it clearly.It this article,we analysis the problem in several dimensions,summarize all kinds of complex BVH structure,and giving some method on how to measure it by numbers so that we use for reference in design,quotation and production.