| 微电子组装中Sn-Zn系无铅钎料的研究与开发 |
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| 引用本文： | 戴志锋,黄继华. 微电子组装中Sn-Zn系无铅钎料的研究与开发[J]. 电子工艺技术, 2004, 25(1): 5-8 |
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| 作者姓名： | 戴志锋 黄继华 |
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| 作者单位： | 北京科技大学,北京,100083 |
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| 摘 要： | 无铅钎料的研究开发是我国电子材料行业目前面临的紧迫课题.其中Sn-Zn系无铅钎料具有低的熔点,优良的力学性能,能获得可靠的钎焊接头,且其原材料丰富、价格便宜,有望替代Sn-Pb钎料.但该系钎料易氧化,抗腐蚀性较差,目前还未得到广泛的采用.介绍了开发新型无铅钎料应满足的要求,及几种有潜力的Sn-Zn系无铅钎料.
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| 关 键 词： | 无铅钎料 Sn-Zn系无铅钎料 |
| 文章编号： | 1001-3474(2004)01-0005-04 |
| 修稿时间： | 2003-07-14 |
Research and Development of Lead - free Sn - Zn Based Solders in Microelectronics Assembly |
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| DAI Zhi - feng,HUANG Ji - hua. Research and Development of Lead - free Sn - Zn Based Solders in Microelectronics Assembly[J]. Electronics Process Technology, 2004, 25(1): 5-8 |
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| Authors: | DAI Zhi - feng HUANG Ji - hua |
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| Abstract: | It is urgent for the electronic material industry to develop Lead - free solders at present. Sn -Zn based solders are attracting to the electronic industry and are expected to be a substitute for Sn - Pb solders . Sn - Zn based solders has low melting temperature and many good properties, can achieve reliable joints. The raw materials of Sn - Zn solders are abundant and cheap, but Sn - Zn solders still have not been used widely because they are easily oxidated and corroded. The present paper is to review the requirements of new Lead - free solders and several new types of Sn - Zn based solders. |
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| Keywords: | Sn-Zn-Ag Sn-Zn-In Sn-Zn-Al Sn-Zn-Bi |
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