夹杂对两相材料界面裂纹的影响

根据界面上应力和位移的连续条件,得到了单向拉伸状态下,含有椭圆夹杂的无限大双材料组合板的复势解。进一步通过求解Hilbert问题,得到了含有夹杂和半无限界面裂纹的无限大板的应力场,并由此给出了裂尖的应力强度因子K。计算了夹杂的形状、夹杂的位置、夹杂的材料选取以及上、下半平面材料与夹杂材料的不同组合对裂尖应力强度的影响。计算结果表明夹杂到裂尖的距离和夹杂材料的性质对K影响较大,对于不同材料组合,该影响有较大差异。夹杂距裂尖较近时,会对K产生明显屏蔽作用,随着夹杂远离裂尖,对K的影响也逐渐减小。另外,软夹杂对K有屏蔽作用,硬夹杂对K有反屏蔽作用,而夹杂形状对K几乎没有影响。

Influence of inclusions on bi-materials interface crack

With the continuity conditions of stress and displacement on material interface,complex potentials solutions for a bi-material infinite plate with an elliptical inclusion under uniaxial tension are given.The stress field of a bi-material infinite plate with an elliptical inclusion and a semi-infinite interface crack are given on the base of the complex potentials solutions obtained above.And the corresponding stress intensity factor K is given.The influences of the position,the shape,material property,and different material combinations of inclusion on the stress intensity factor K are calculated.The results indicate that the distance of inclusion from crack tip and the property of inclusion have remarkable influence on the stress intensity factor K,and these influences vary notably with different material combinations,whereas the shape of inclusion has little influence on K.When the inclusion is soft,the shield effect is occurred for K; conversely,it is inverse shield.