| 真空电子器件用Ga基堵漏钎料的研究 |
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| 引用本文： | 李海涛,曲文卿,庄鸿寿.真空电子器件用Ga基堵漏钎料的研究[J].真空电子技术,2011(3):55-58,61. |
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| 作者姓名： | 李海涛 曲文卿 庄鸿寿 |
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| 作者单位： | 北京航空航天大学,机械工程及自动化学院,北京,100191 |
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| 摘 要： | 研制成功三种无氧铜真空电子器件堵漏钎料。应用扫描电镜、能谱分析仪、微观硬度仪,研究了三种钎料形成的扩散接头界面连接情况,进行了不同扩散温度下的对比试验。结果表明：三种钎料都能与无氧铜形成良好的相互扩散效果;在三种钎料中,Ga-15In钎料与无氧铜形成的相互扩散效果最好;在不同扩散温度下进行试验,Ga-15In钎料在650℃达到与无氧铜形成的相互扩散效果最佳。
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| 关 键 词： | 真空电子器件 扩散钎焊 镓基钎料 无氧铜 |
Study of Ga-Based Brazing Fillers in Stockage of Vacuum Electronic Devices |
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| LI Hai-tao,QU Wen-qing,ZHUANG Hong-shou.Study of Ga-Based Brazing Fillers in Stockage of Vacuum Electronic Devices[J].Vacuum Electronics,2011(3):55-58,61. |
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| Authors: | LI Hai-tao QU Wen-qing ZHUANG Hong-shou |
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| Institution: | LI Hai-tao,QU Wen-qing,ZHUANG Hong-shou(Beijing University of Aeron.& Astro,Beijing,100191,China) |
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| Abstract: | This paper successfully developed three kinds of brazing fillers of OFHC vacuum electronic devices.The interface connection was analyzed by scanning electron microscopy and asperses X-ray spectrometry.The diffusive behaviors were studied at different diffusion temperature.The results show that,three kinds of fillers can achieve satisfied interdiffusion effect with OFHC.The inter-diffusion effect of Ga-15In solder is best in three kinds,and the Ga-15In solder get the best effect at 650℃. |
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| Keywords: | Vacuum electronic devices Diffusing brazing Ga-based brazing fillers OFHC |
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