印制板翘曲品质改善研究

随着电子产品向轻、薄、小的方向发展。印制板的封装方式也在不断的改变,这就对PCB的制造提出了更高的要求,特别是印制板的平整度要求,只有保证PCB在PCBA过程中有很高的平整度,才能保证SMD引脚与板面焊盘的焊接,才能保证SMT过程的质量(包括网印焊膏、贴片、等工序)。分析了造成翘曲问题的主要原因,从分析中可以看出,其原因是多方面的,可以说是从供应商的基板来料开始,一直到做成成品的印制板,还有在客户的SMT过程中,都有机会造成翘曲问题,就引起翘曲问题的主要原因进行研究,通过对印制板的排板结构的设计、压合工序的影响及FQC翻压工序分别进行了DOE实验研究,共进行了70多个工艺实验,对试验结果进行统计分析,找出影响翘曲的主要影响因素,并进行参数优化,达到改善翘曲品质的目的。

PCB warpage defect improvement study

More strictly quality standard for PCB manufacturing is demanded because of electronic products becoming smaller and thinner, especially for PCB flat degree requirement. Nowadays, only high fiat PCB can guarantee welding quality and SMT process reliability in PCBA process, This thesis probed the fundamental causes of leading PCB warpage, as well known PCB process is very complex and many processes can create warpage from incoming CCL from supplier to SMT process in customer. A series of studies showed that there were three main processes to affect the warpage including PCB design, press process and FQC dewarp process.Taguchi method was employed to factors designing. DOE consisting of 70 experiments were carried out in order to find the main factors and main effect of factors, interaction among of factors. Analysis of variance selected to analyze the data of DOE and parameters optimization was developed in DOE.