化学镀厚铜故障的处理

化学镀厚铜不需要电镀设备和昂贵的阳极材料，沉铜后经防氧化处理即可进入图形转移工序，然后直接进行图形电镀，缩短了生产流程，有着非常广泛的应用。但由于化学镀厚铜沉积时间长，镀层较厚，在生产中如果参数控制不到住，容易出现镀层起皮和结合力差等问题。文中对某厂在化学镀厚铜过程中出现的一次孔口起皮故障进行了原因分析和跟踪，提出了预防出现类似问题的方法。

Resolution to the breakdown of electroless thick copper plating

There is no need of plating equipments and expensive anode for electroless thick copper plating The treated copper-clad board can be transferred to the pattern plating process after anti-oxidation treatment and image transfer process, so, the process flow is shortened. The electroless thick copper plating process has been widely utilized because of the above advantages. But the fault of peeling layer and poor adhesion may appear if the operation parameters can not be exactly controlled in consequence of the process has long deposition time and thick layer. In this article, the cause was analyzed of the fault of peeling layer appeared during electroless thick copper plating process. The methods to prevent similar problems were offered.