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Asymmetry in electrical properties of Al‐doped TiO2 film with respect to bias voltage
Authors:Woojin Jeon  Sang Ho Rha  Woongkyu Lee  Cheol Hyun An  Min Jung Chung  Sang Hyun Kim  Cheol Jin Cho  Seong Keun Kim  Cheol Seong Hwang
Institution:1. Department of Materials Science and Engineering and Inter‐university Semiconductor Research Center, Seoul National University, Seoul, Republic of Korea;2. Process Development Team, Semiconductor R&D Center, Samsung Electronics Co. Ltd., Gyeonggi‐do, Republic of Korea;3. Center for Electronic Materials, Korea Institute of Science and Technology, Seoul, Republic of Korea
Abstract:The energy diagram of RuO2/Al‐doped TiO2/RuO2 structures was estimated from the capacitance–voltage and leakage current density–voltage curves. The Al‐doping profile in TiO2 film was varied by changing position of the atomic layer deposition cycle of Al2O3 during the atomic layer deposition of 9 nm‐thick TiO2 film. The interface between the TiO2 film and the RuO2 electrode containing Al‐doping layer showed a higher Schottky barrier by 0.1 eV compared with the opposite interface without the doping layer. The evolution of various leakage current profiles upon increasing the bias with opposite polarity could be well explained by the asymmetric Schottky barrier. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)
Keywords:TiO2  Al doping  capacitance  leakage current  asymmetric Schottky barrier  thin films
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