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Ultra high amorphous silicon passivation quality of crystalline silicon surface using in‐situ post‐deposition treatments
Authors:H. Meddeb  Twan Bearda  Wissem Dimassi  Yaser Abdulraheem  Hatem Ezzaouia  Ivan Gordon  Jozef Szlufcik  Jef Poortmans
Affiliation:1. KACST‐Intel Consortium Center of Excellence in Nano‐manufacturing Applications (CENA), Riyadh, KSA;2. IMEC, Leuven, Belgium;3. Research and Technology Center of Energy, Photovoltaic Department, Hammam‐Lif 2050, Tunisia;4. University of Carthage Faculty of Sciences of Bizerta, Tunisia;5. Electrical Engineering Department, College of Engineering and Petroleum, Kuwait University, Safat, Kuwait;6. Faculty of Sciences, University of Hasselt, 3500 Hasselt, Belgium
Abstract:A parametric study of post‐deposition hydrogen plasma treatment of intrinsic a:Si:H films is performed. We demonstrate a significant improvement in passivation of c‐Si(100) promoting epitaxy after an in‐situ hydrogen plasma treatment depending mainly on the pressure and slightly on the power. Plasma diagnostic indicates an increase of Hα* signal with high power and low pressure. However, our analysis reveals a better hydrogen incorporation with high pressure and a slight increase in monohydride with high power. Longer H2 plasma duration up to 50 s shows no detrimental effect on the passivation quality. Optimizing the in‐situ H2 plasma treatment, high minority carrier lifetime over 15 ms was achieved after short thermal annealing. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)
Keywords:surface passivation  amorphous materials  silicon  hydrogen  plasma treatment  PECVD
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