| 板壳状微电子器件的数字层析成像检测方法 |
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| 引用本文： | 傅健,王宏钧,李斌,江柏红.板壳状微电子器件的数字层析成像检测方法[J].电子学报,2010,38(7):1580-1584. |
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| 作者姓名： | 傅健 王宏钧 李斌 江柏红 |
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| 作者单位： | 北京航空航天大学机械工程及自动化学院,北京,100191 |
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| 基金项目： | 国家自然科学基金，航空科学基金，北京市科技新星计划，北京市自然科学基金 |
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| 摘 要： | 传统工业CT(industrial computed tomography, ICT)成像方法受扫描原理和探测器、射线源等硬件条件的限制，难以对芯片、印刷电路板等板、壳状微电子器件实施有效的数字层析成像检测. 为此，讨论了一种基于锥束射线倾斜扫描和代数重建技术（Algebraic Reconstruction Technique, ART）的薄板层析成像（Computed Laminography, CL）方法，研究了其基于投影凸集理论的投影预处理方法及基于不同区域相似性的重建图像非局部平均降噪后处理方法，建立了基于非晶硅面阵探测器的实验系统，并完成了CPU芯片和印刷电路板的CL成像. 实验结果证明了该方法的正确性.
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| 关 键 词： | 层析成像 薄板层析成像 代数重建技术 投影凸集 板壳状微电子器件 |
| 收稿时间： | 2008-11-6 |
| 修稿时间： | 2009-11-8 |
Computed Laminography Imaging Inspection Method for Plate-Shell Microelectronic Devices |
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| FU Jian,WANG Hong-jun,LI Bin,JIANG Bai-hong.Computed Laminography Imaging Inspection Method for Plate-Shell Microelectronic Devices[J].Acta Electronica Sinica,2010,38(7):1580-1584. |
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| Authors: | FU Jian WANG Hong-jun LI Bin JIANG Bai-hong |
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| Institution: | FU Jian,WANG Hong-jun,LI Bin,JIANG Bai-hong(School of Mechanical Engineering and Automation,Beijing University of Aeronautics and Astronautics,Beijing 100191,China) |
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| Abstract: | Limited by the scan principle and the hardware such as detectors and X-ray sources,conventional industrial computed tomography(ICT) can not execute the effective tomography imaging of plate-shell microelectronic devices.In order to realize the tomography imaging of this kind of microelectronic device,a method called computed laminography(CL) has been researched.It is based on the cone-beam X-ray tilt scan and the algebraic reconstruction technique(ART).The projection pre-processing method based on the proje... |
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| Keywords: | tomography computed laminography algebraic reconstruction technique projection convex on sets plate-shell microelectronic devices |
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