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Quantification of dopant species using atom probe tomography for semiconductor application
Authors:Wai Kong Yeoh  Shih-Wei Hung  Shih-Che Chen  Yi-Hsiang Lin  Jang Jung Lee
Institution:1. Failure Analysis Division, Taiwan Semiconductor Manufacturing Company, Ltd, Hsinchu, Taiwan;2. Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan
Abstract:Doping of semiconductors serve various purposes in metal-oxide-semiconductor (CMOS) technology, eg, increase carrier concentration and modify electric field distribution. With the scaling down of device and the introduction of three-dimensional fin field-effect transistors (FinFET), precise and reliable dopant quantification of concentration at the nano-scale is critical. Laser-assisted atom probe tomography (APT) provides a unique approach to characterize and quantify the dopant in three dimensions at sub-nanometer resolution. Nevertheless, quantification accuracy of APT is strongly influenced by the experimental conditions. Although B quantification has been widely studied, the correlation of B signal loss to B concentration is not yet established. In addition, no phosphorous quantification study has been reported. In this work, we found that, due to B multi-hit effect in APT, high B dose sample has larger B loading compared with low B dose sample. For standard calibration with minimized impact from multi-hit effect, we recommend B dose in the range of 1e14 atoms/cm2. Despite the fact that B loading is dose dependent, APT quantification of B achieves precision within 2% to 6% relative standard deviation (RSD), which demonstrates that APT has good accuracy. On the other hand, P quantification suffers from mass interference of 31P+ and 31P22+ at 31 Da resulting in a large loading between APT and secondary ion mass spectrometry (SIMS). Nevertheless, we recommend that 31 Da to be labeled as 31P+ for smaller P variation for the APT analysis.
Keywords:atom probe tomography  dopant quantification  Si-based semiconductor
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