A novel method for sacrificial layer release in MEMS devices fabrication |
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Authors: | Shi Sha-Li Chen Da-Peng Jing Yu-Peng Ou Yi Ye Tian-Chun and Xu Qiu-Xia |
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Institution: | Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China |
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Abstract: | During the forming process of the free-standing structure or the functional cavity when releasing the high aspect ratio sacrificial layer, such structures tend to stick to the substrate due to capillary force. This paper describes the application of pull-in length conception as design rules to a novel `dimpled' method in releasing sacrificial layer. Based on the conception of pull-in length in adhering phenomenon, the fabrication and releasing sacrificial layer methods using micro bumps based on the silicon substrate were presented. According to the thermal isolation performances of one kind of micro electromechanical system device thermal shear stress sensor, the sacrificial layers were validated to be successfully released. |
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Keywords: | sacrificial layer adhering pull in length bump |
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