| 电子系统封装器件的传热研究 |
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| 引用本文： | 李长庚,周孑民,张家元.电子系统封装器件的传热研究[J].电子元件与材料,2003,22(7):17-19. |
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| 作者姓名： | 李长庚 周孑民 张家元 |
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| 作者单位： | 1. 中南大学物理学院,湖南,长沙,410083
2. 中南大学能源与动力工程学院,湖南,长沙,410083 |
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| 基金项目： | 教育部博士点基金资助项目(20010533009) |
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| 摘 要： | 开发了一个电子系统封装(SIP)典型器件的传热模型,用数值方法模拟了器件的热传递过程和温度分布状况,探讨了各种设计参数和物性参数对温度场的影响。计算结果表明:当t = 1 400 s,以LCP为基板时SIP器件传热过程达到稳定态,基板导热系数和对流换热系数是影响器件散热速率的关键参数,此外还计算了对于不同的环境对流换热系数和不同基板材料,不使芯片产生热失效所允许的输入功率耗散密度。这为研究高密度电子封装器件的热特性,进一步改善器件的热性能提供了理论依据。
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| 关 键 词： | 电子系统封装 热性能 热传递 |
| 文章编号： | 1001-2028(2003)07-0017-03 |
An Investigation into Heat Transfer of Electronic System Packaging |
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| LI Chang-geng,ZHOU Jie-min,ZHANG Jia-yuan.An Investigation into Heat Transfer of Electronic System Packaging[J].Electronic Components & Materials,2003,22(7):17-19. |
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| Authors: | LI Chang-geng ZHOU Jie-min ZHANG Jia-yuan |
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| Institution: | LI Chang-geng1,ZHOU Jie-min2,ZHANG Jia-yuan2 |
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| Abstract: | A heat transfer model of SIP was developed to predict the heat dissipation capacity and to investigate the effects of different factors on the temperacture distribution in the electronics. At t =1 400 s, the heat transfer process in SIP with liquid crystal polymer substrate reaches its steady state. The affecting parameters under consideration include the thermophysical properties of the substrates, the coefficient of convection heat transfer, and the density of power dissipation. Based on the model simulation and analysis of the heat conduction and convection resistances, criteria for the thermal design are established.The control procedure in heat transfer and the possibility for enhancing heat dispersion are discussed. |
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| Keywords: | electronic system packaging thermal properties heat transfer |
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