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Properties of thick SiO2/Si structure formed at 120 °C by use of two-step nitric acid oxidation method
Authors:S. Imai  S. Mizushima  Asuha  W.-B. Kim  H. Kobayashi
Affiliation:a Display Technology Development Group, Sharp Corporation, Tenri, Nara 632-8567, Japan
b Institute of Scientific and Industrial Research, Osaka University, Ibaraki, Osaka 567-0047, Japan
c CREST, Japan Science and Technology Agency, Japan
Abstract:Thick (i.e., ∼10 nm) SiO2/Si structure has been formed at 121 °C by immersion of Si in relatively low concentration HNO3 followed by that in 68 wt.% HNO3 (i.e., two-step nitric acid (HNO3) oxidation method of Si, NAOS) and spectroscopic properties and electrical characteristics of the NAOS SiO2 layers are investigated. The SiO2 thickness strongly depends on the concentration of HNO3 aqueous solutions employed in the initial oxidation, and it becomes the largest at the HNO3 concentration of 40 wt.%. The MOS diodes with the ∼9 nm SiO2 layer formed by the NAOS method possess a relatively low leakage current density (e.g., 10−8 A/cm2 at the forward bias of 1 V) and it is further decreased by more than one order of magnitude by post-metallization annealing (PMA) in hydrogen at 250 °C. The good leakage characteristic is attributable to atomically flat SiO2/Si interfaces and high atomic density of 2.30-2.32 × 1022 atoms/cm3 of the NAOS SiO2 layers. High-density interface states are present in as-prepared SiO2 layers and they are eliminated by PMA in hydrogen.
Keywords:Low-temperature oxidation   Nitric acid oxidation   Silicon   SiO2   Interface states   Hydrogen treatment   Metal-oxide-semiconductor (MOS)
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