Computational electromagnetic methods for interconnects and small structures

The continual advances in speed and integration scale of electronic circuits have created enormous demands for high-speed, high-density packages which ensure reduced interconnection delays and improved electrical performance. Such structures usually involve a large number of planar transmission lines at various levels within the package, whereas the geometrical orientation of these lines is not necessarily uniform. Also, the existence of multiple dielectric layers, discontinuities, bends, and wire bounds adds considerable complexity to the package. It is therefore essential that full-wave computational electromagnetic (CEM) techniques, such as the finite element method (FEM) and the finite-difference time-domain (FDTD) method, be developed and used to accurately model the electrical performance of these devices and circuits.