Thermal effect analysis on crosstalk and performance of optoelectronic transmitter modules for optical interconnects |
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| Authors: | Ikechi Augustine Ukaegbu M Rakib Uddin Jamshid Sangirov Nga T H Nguyen Tae-Woo Lee Mu Hee Cho Hyo-Hoon Park |
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| Institution: | 1.Nano Electronic and Photonic Systems Laboratory, Department of Electrical Engineering,Korea Advanced Institute of Science and Technology,Daejeon,Korea;2.Electrical and Electronic Engineering Programme Area,Universiti Teknologi Brunei,Gadong,Brunei;3.Department of Information and Communications Engineering,Korea Advanced Institute of Science and Technology,Daejeon,Korea;4.Samsung Electronics Co. Ltd.,Suwon,Korea;5.LSmtron,Dongan-Gu,Korea |
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| Abstract: | This paper presents thermal analysis on crosstalk and performance of optoelectronic transmitter modules and also demonstrates the thermal analysis for efficient heat dissipation for the transmitter modules. The thermal crosstalk model for analysis is based on interconnects parameters for vertically stacked and horizontally packaged optoelectronic transmitter modules. While the analytical expression is used to estimate the thermal critical frequency, f crit_th , above which signals become severely deteriorated, a Teflon-based thermal printed circuit board (PCB) has been designed for packaging the optoelectronic transmitter modules to ensure efficient heat dissipation. The thermal and performance analysis of the packaged modules show that the chips operate at temperatures below the f crit_th , which is apt for reliable data and signal transmission. |
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