| 高密度封装技术的发展 |
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| 引用本文： | 鲜飞.高密度封装技术的发展[J].微电子技术,2003,31(4):14-15,18. |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信股份有限公司,湖北武汉,430074 |
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| 摘 要： | 本文简要介绍了BGA与CSP的概念、发展现状、应用情况及发展趋势等。BGA／CSP是现代组装技术的两个新概念，它们的出现促进SMT(表面贴装技术)与SMD(表面贴装元器件)的发展和革新，并将成为高密度、高性能、多功能及高I／O数封装的最佳选择。
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| 关 键 词： | 表面贴装技术 球栅阵列封装 芯片尺寸封装 倒装芯片 |
| 文章编号： | 1008-0147(2003)04-14-02 |
The Development of High Density Packaging Technology |
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| XIAN Fei.The Development of High Density Packaging Technology[J].Microelectronic Technology,2003,31(4):14-15,18. |
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| Authors: | XIAN Fei |
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| Abstract: | The concepts of BGA/CSP, the current situation and developing trends of them, and the states of their applications are simply introduced in this paper. Both BGA and CSP are new concepts of contemporary assembly technology. Since BGA and CSP were developed, they have promoted the development and innovation of SMT and SMD. It is believed that BGA and CSP will be the best choice of the package for IC with high density, high performance, multifunction and high I/Os. |
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| Keywords: | SMT BGA CSP Flip chip |
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