用于倒装芯片的晶片凸点制作工艺研究

倒装芯片在电子封装互连中占有越来越多的份额，是一种必然的发展趋势，所以对倒装芯片技术的研究变得非常重要。倒装芯片凸点的形成是其工艺过程的关键。现有的凸点制作方法主要有蒸镀焊料凸点、电镀凸点、微球装配方法、焊料转送、在没有UBM的铅焊盘上做金球凸点、使用金做晶片上的凸点、使用镍一金做晶片的凸点等。每种方法都各有其优缺点，适用于不同的工艺要求。介绍了芯片倒装焊基本的焊球类型、制作方法及各自的特点，总结了凸点制作应注意的问题。

Research on Fabrication Technology of Bumps for Flip Chip

Flip-chip is becoming more and more important, it is an inevitable trend of development. So flip-chip technology studies become very important. Flip-chip bump formation is a key process, there are many ways to make Flip-chip bump. This is an overview of the existing bump fabrication technology. Many bumping technologies have been developed. The major bumping methods, such as evaporation, plating, dectroplating, Micro ball, etc, are all introduced. We can see that every method has its merits as well as demer...