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电子纸微杯结构金属模具的设计与制作
引用本文:浦东林,胡进,朱鹏飞,魏国军,陈林森.电子纸微杯结构金属模具的设计与制作[J].液晶与显示,2011,26(2):174-177.
作者姓名:浦东林  胡进  朱鹏飞  魏国军  陈林森
作者单位:1. 苏州大学信息光学工程研究所,江苏,苏州,215006
2. 苏州苏大维格光电科技股份有限公司,江苏,苏州,215026
基金项目:国家自然科学基金资助项目(No.60777039)
摘    要:提出了用于电子纸的微结构金属模具的"选择生长"方法,即通过在金属基材上形成选择性的导电与不导电图形,来制作深纹的"微杯"金属模具。在金属基材上涂布负性光刻材料、用带有空间光调制器的激光直写系统曝光形成"微杯"图形,然后通过电铸工艺制作出镍金属模具。实际制作的"蜂窝"分布的微杯结构参数与设计参数基本吻合。该工艺流程适合研制更大尺寸的电子纸的微杯模具,将为"微杯"模具制作提供一种有效手段。

关 键 词:电子纸  微杯模具  光刻电铸

Design and Fabrication of Metal Microcup Mould for E-Paper
PU Dong-lin,HU Jin,ZHU Peng-fei,WEI Guo-jun,CHEN Lin-sen.Design and Fabrication of Metal Microcup Mould for E-Paper[J].Chinese Journal of Liquid Crystals and Displays,2011,26(2):174-177.
Authors:PU Dong-lin  HU Jin  ZHU Peng-fei  WEI Guo-jun  CHEN Lin-sen
Institution:PU Dong-lin1,HU Jin1,ZHU Peng-fei2,WEI Guo-jun1,CHEN Lin-sen1(1.Information Optical Engineering Institute of Suzhou University,Suzhou 215006,China,E-mail:pudonglin@suda.edu.cn,2.SVG Optronics,Suzhou 215026,China)
Abstract:A 'selective grow' method for fabricating E-paper metal mould was approached.The microcup pattern with insulating material was made on metal substrate and the mould was obtained with follow-up process.First,Negative photo resists was coated on the metal substrate and the microcup pattern was exposed by a SLM LDW system.Second,after developing process,the metal mould was made by electroforming.The experiment results are according to the input parameters.This method is suit for larger format process,it will b...
Keywords:E-paper  microcup mould  LIGA  
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