Spectroscopic analysis of packaging concepts for high-power diode laser bars |
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Authors: | Martin Hempel Mathias Ziegler Sandy Schwirzke-Schaaf Jens W Tomm Denny Jankowski Dominic Schr?der |
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Institution: | (1) Max-Born-Institut, Max-Born-Str. 2A, 12489 Berlin, Germany;(2) Fachgruppe VIII.4, Bundesanstalt f?r Materialforschung und -pr?fung, 12200 Berlin, Germany;(3) JENOPTIK Laser GmbH, Goeschwitzer Strasse 29, 07745 Jena, Germany;; |
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Abstract: | Double-side cooled high-power diode laser bars packaged by different techniques on different types of passive heat sinks are
analyzed in terms of packaging-induced strain. Reference data from standard devices being single-side cooled only and packaged
by conventional soft and hard soldering are also presented. Thermal profiling across the devices complements the results.
The most suitable packaging architecture and technique for double-side cooled bars is identified. Measurements of the laser
emission near field and electroluminescence pattern provide direct reference to the functionality of the devices. Furthermore,
a type of cross calibration of the methods used for strain analysis is made, since all techniques are applied to the same
set of bars. This involves micro photoluminescence, micro Raman, and degree-of-polarization electroluminescence spectroscopy. |
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