芯片封装测试产业上的功能安全

ISO 26262道路车辆功能安全标准是以产品功能安全设计导入为核心,同时包含产品安全生命周期中的制造环节。封装测试是半导体制造过程中重要的一环,研究工作着重在芯片从设计到封装测试的功能安全任务链接、转移与执行,包含封装厂商如何在芯片设计前端提供封装故障率预估,以评估硬件架构指标和随机硬件故障机率指标,确定功能安全设计的符合性。将产品设计中与安全相关的关键参数在量产过程中得到适当的管制,确保功能安全设计在产品上的实现。同时评估应用于封装设计、测试软件设计的软件工具信赖度,以及增强封装可靠度以减小故障率等课题。

Topics on ISO 26262 Functional Safety for IC Packaging and Testing Vendor of Semiconductor

The ISO 26262 road vehicle-functional safety is a standard to conduct product functional safety design as core task and also include the manufacturing in the product safety lifecycle.Since packaging and testing processes are the important part of the semiconductor manufacturing,this research in this paper focuses on the functional safety task linking from IC design to packaging and testing,including,how packaging houses provide package failure rate estimation to chip designer to evaluate hardware architecture metrics and probabilistic metric for random hardware failures to determine compliance with functional safety design;The critical safety parameters defined in design are properly controlled in the mass production to ensure the realization of functional safety design on the product;Evaluating the confidence in use of software tool used in package design and test software design,and enhancing the reliability of the package to reduce the failure rate.