The Influence of Bromine Adsorption on Copper Electrodeposition on Polycrystalline Gold Electrodes Modified with Self-Assembled Monolayers

The influence of bromine adsorption on copper electrodeposition on a polycrystalline gold electrode modified with self-assembled monolayers (SAMs) has been investigated by chronoamperometry and cyclic voltammetry. It was found that the deposition potential of copper was shifted negatively due to the SAMs. The hydrogen bond interaction between omega-carboxyl thiols decreased the defect density of the SAMs and significantly retarded the deposition of copper. The presence of bromide anions also shifted the potential more negatively through adsorption into the defects of SAMs. Copyright 2001 Academic Press.