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Honeycomb‐Patterned Polyimide Film as a Versatile Coating for High‐Performance Dielectric Material
Authors:Dr Yingyi Ma  Le Xu  Dr Zijian Wu  Dr Wenlong Zhang  Dr Mingyan Zhang  Dr Zhenfeng He
Institution:1. School of Materials Science and Engineering, Harbin University of Science and Technology, Harbin, China;2. National Demonstration Center for Experimental Chemical Engineering Comprehensive Education, School of Chemical Engineering and Technology, North University of China, Taiyuan, China
Abstract:A honeycomb‐patterned porous film was conveniently prepared by means of the microemulsion method and then used as an effective coating for improving the dielectric properties and water resistance of polyimide (PI) film while maintaining its mechanical properties. The dielectric properties could be regulated by tuning the structure of the porous film through controlling its formation conditions. When suitable conditions were used, the prepared composite PI film exhibited a significant reduction of 28.3 % in its dielectric constant and 9.48–54.99 % in dielectric loss accompanied by an extremely low water uptake of 0.62 % relative to the 2.47 % of flat PI film. The composite PI film also displayed excellent durability under moist conditions, as the dielectric constant was still below 2.4 after exposure to 75 % relative humidity for more than 12 h. This provides a novel method to improve and control the dielectric properties of materials. It also suggests that this film is a suitable candidate for coating dielectric materials in high‐humidity environments.
Keywords:dielectric properties  membranes  microemulsion  porosity  self-assembly
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