| Ni/Cu电极MLCC烧成工艺的研究 |
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| 引用本文： | 赖永雄,唐浩,李基森.Ni/Cu电极MLCC烧成工艺的研究[J].电子元件与材料,2005,24(7):21-24. |
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| 作者姓名： | 赖永雄 唐浩 李基森 |
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| 作者单位： | 风华高新科技股份有限公司,广东,肇庆,526020;风华高新科技股份有限公司,广东,肇庆,526020;风华高新科技股份有限公司,广东,肇庆,526020 |
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| 基金项目： | 国家高技术研究发展计划(863计划) |
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| 摘 要： | 通过各项工艺对比实验,研究了烧成工艺参数对成品性能的影响。给出了最佳工艺参数:烧结温度为1280～1300℃,保温2h,用N2/H2/H2O的混合气控制P(O2)为10–8～10–10MPa,回火温度900～1100℃,保温2～5h,回火气氛氧含量(5～50)×10–6;1000℃以上的升降温速率控制在2～4℃/min。在此工艺条件下,选用合适的烧炉,可以得到性能合格的Ni/Cu电极MLCC。
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| 关 键 词： | 电子技术 MLCC Ni/Cu电极 烧成工艺 气氛保护 |
| 文章编号： | 1001-2028(2005)07-0021-04 |
Study on Sintering Process of Ni/Cu Electrode MLCC |
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| LAI Yong-xiong,TANG Hao,LI Ji-sen.Study on Sintering Process of Ni/Cu Electrode MLCC[J].Electronic Components & Materials,2005,24(7):21-24. |
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| Authors: | LAI Yong-xiong TANG Hao LI Ji-sen |
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| Abstract: | The effects of the sintering craft parameters on properties of MLCC were studied. The best sintering process parameters were work out: sintering temperature was 1 280～1 300 ℃,soaking 2 hrs, P(O2) was 10–8～10–10 MPa controlled by N2/H2/H2O mixing gas; annealing temperature was 900～1 100 ℃, soaking 2～5 hrs and the O2 content was (5～50)×10–6; the speed of increasing and decreasing temperature was controlled to 2～4℃/min above 1 000℃. Using these parameters ,and also choosing fit kiln, then good quality Ni/ Cu electrode MLCC can be gotten. |
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| Keywords: | MLCC |
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