| 优化PCB组件热设计的热模拟 |
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| 引用本文： | 胡志勇.优化PCB组件热设计的热模拟[J].印制电路信息,2009(7):62-64,72. |
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| 作者姓名： | 胡志勇 |
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| 作者单位： | 华东计算技术研究所,上海,201233 |
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| 摘 要： | 随着高速PCB设计的数量不断的增加，对确保布线、信号完整性和热设计要求造成了很大的困难。为了能够满足PCB设计限制因素数量的增加，对于每一个设计人员来说会面临着非常大的压力。通过热设计模型可以在满足热设计要求和信号完整性要求之间进行权衡折衷。
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| 关 键 词： | 热设计 热模拟 热分析软件 电路板设计 |
Thermal Simulation for Thermal Design Optimization of PCBs |
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| HU Zhiyong.Thermal Simulation for Thermal Design Optimization of PCBs[J].Printed Circuit Information,2009(7):62-64,72. |
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| Authors: | HU Zhiyong |
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| Institution: | HU Zhi-yong |
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| Abstract: | The increasing density of high-speed PCB designs is making it more difficult to simultaneously meet layout, signal integrity and thermal requirements. Attempting to satisfy an increasing number of PCB design constraints is putting more pressure than ever on designers. Thermal modeling balances the tradeoffs between thermal compliance and signal integrity requirements. |
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| Keywords: | thermal design thermal simulation thermal analysis software PCB design |
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