提高倒装芯片组装速度的在线测试

倒装芯片是一种性能价格比良好的互连技术 ,要求采用富有创新的操作 ,以满足KGD的测试方法和操作工艺的需要。在基片上贴装好以前应立刻进行测试以确保能够起作用的管芯才能被装配入到倒装芯片或者说印刷电路板上面。在线测试设备是一种能够满足这些性能要求和价格要求的设备

In-Line Test Speeds Flip Chip Assembly

Utilization of flip chip as cost-effective interconnect technology requires innovative handling, test methods and processes for KGD. Testing die immediately before placement onto a substrate ensures that only functional die are assembled into an flip chip or printed circuit board (PCB). In-line testing equipment is a system that meets these performance and cost requirements.