硬质粒子扰动下铜电沉积研究

使用常规旋转电极电沉积技术,引入陶瓷球等一类硬质粒子,在旋转电极的带动下,使陶瓷球不断磨擦和撞击阴极表面而实现电铸铜.对比酸性溶液电铸铜和碱性溶液电铸铜,发现硬质粒子在电沉积过程中能扰动离子的放电过程,并影响电铸层的组织结构.但由于二者放电机理不同,前者形成的电铸层表面布满尖状毛刺,而后者则表面尖刺消失,但脆性大.SEM和XRD测试表明,由碱性电铸液沉积的电铸铜层,表面光亮平整,晶粒致密,大小约为100~300 nm,其结晶形态接近无序取向.

Copper Electrodeposition Under the Perturbation of Hard Particles

Copper electrodepositon was carried out on the rotating cathode,with hard particles(such as ceramic beads) filling between the electrodes.The rotation of cathode led hard particles to polish and impact the surface of deposit during electrodeposition.Copper deposits with a mass of cuspidal nodules were produced in acid sulfate solutions while brittle deposits without nodules were produced in alkaline sulfate solutions.It was also found that brightening and smoothing deposit could be obtained from the alkaline solution,and the deposit was approximatively disordered orientation with granular morphology of about 100~300 nm.The results show that the polishing and impact of hard particles can effectively disturb the discharge of cations,simultaneously influence the microstructure of deposits.