微电子封装中导电胶连接可靠性研究

导电胶连接是近年来发展起来的新技术,其连接可靠性对于连接器件的长期稳定运行至关重要.本文基于导电胶互连失效模式的分析,介绍了各向异性导电胶膜的力学性能,综述了外力载荷、环境因素和组件性能对导电胶连接可靠性影响的研究进展,给出了导电胶粘接接触电阻、粘接强度和失效概率的理论分析,以及连接器件界面残余应力和疲劳寿命的研究.最后,针对导电胶连接可靠性研究中涉及的主要方面进行了展望.

STUDY ON BONDING RELIABILITY OF ELECTRICALLY CONDUCTIVE ADHESIVES FOR MICROELECTRONICS PACKAGING

Electrically conductive adhesive (ECA) bonding is a kind of new packaging technology developed in recent years and its reliability is crucial for the stable operation of ECA bonding assembly. Based on the failure modes of ECA joints, the mechanical properties of Anisotropic Conductive Film (ACF) are introduced and the effects of mechanical loading, environmental factors and properties of the components on the reliability of ECA joints are reviewed in the paper. Theoretical analysis of the contact resistance, bonding strength and failure probability of ECA is presented. Additionally the interfacial residual stress and fatigue life of ECA joints are discussed. Finally, the future researches are proposed for reliability of ECA joints.