Fracture and Fragmentation of Silicon Dies |
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Authors: | Christoph Laun Anna Pandolfi Aldo Ghisi Kerstin Weinberg |
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Affiliation: | 1. Chair of Solid Mechanics, Department of Mechanical Engineering, University of Siegen, Paul-Bonatz-Str. 9-11, D-57068 Siegen, Germany.;2. Dipartimento di Ingegneria Strutturale, Politecnico di Milano, Piazza L. da Vinci 32, I-20133 Milano, Italy. |
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Abstract: | Different failure modes of silicon are observed. Experimental results are not able to explain these variations clearly and therefore numerical simulations have been performed. In order to reduce high computational costs a simplified method to introduce weakened areas on silicon chips is presented. (© 2010 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim) |
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