| 铜箔制程对CCL及PCB要求的应对 |
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| 引用本文： | 杨祥魁,刘建广,徐树民,徐策,宋召霞.铜箔制程对CCL及PCB要求的应对[J].印制电路信息,2012(1):9-14. |
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| 作者姓名： | 杨祥魁 刘建广 徐树民 徐策 宋召霞 |
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| 作者单位： | 山东金宝电子股份有限公司,山东招远,265400 |
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| 摘 要： | PCB和CCL行业的高速发展,对作为其基础材料的铜箔提出了更多要求。铜箔必须同时满足PCB和CCL的多项性能要求,这给铜箔生产商带来了严峻的技术挑战和难得的发展机遇。从铜箔生产制成控制原理、方法和实际管控等方面,讨论铜箔如何应对CCL和PCB高度发展要求。
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| 关 键 词： | 铜箔 覆铜板 印制电路板 |
Production process of copper foils to meet requirements of CCL and PCB |
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| YANG Xiang-kui LIU Jian-guang XU Shu-min XU Ce SONG Zhao-xia.Production process of copper foils to meet requirements of CCL and PCB[J].Printed Circuit Information,2012(1):9-14. |
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| Authors: | YANG Xiang-kui LIU Jian-guang XU Shu-min XU Ce SONG Zhao-xia |
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| Institution: | YANG Xiang-kui LIU Jian-guang XU Shu-min XU Ce SONG Zhao-xia |
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| Abstract: | As basic materials,copper foils are proposed more requests with rapid development of PCB and CCL industry.In order to meet many performance requirements at the same time,the manufacturers of copper foils are faced with rigorous challenge of technologies and precious development opportunities.In this paper,the production process of copper foils,including control principle,method and actual control and so on,are discussed to meet the requests of rapid development of PCB and CCL industry. |
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| Keywords: | Copper Foils Copper Clad Laminate Printed Circuit Board |
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