| 对表面贴装设备带来影响的BGA器件 |
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| 引用本文： | 胡志勇.对表面贴装设备带来影响的BGA器件[J].电子工业专用设备,2005,34(10):48-51. |
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| 作者姓名： | 胡志勇 |
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| 作者单位： | 华东计算技术研究所,上海,201800 |
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| 摘 要： | BGA技术的出现给制造业带来了压力,迫使人们要用一种新的眼光来寻找装配工艺方法。为了能够满足产品小型化的要求,能够降低引脚针间距的芯片规模封装和倒装芯片技术,将永无止境地向前发展,精确贴装的能力将继续是一个非常重要的因素。
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| 关 键 词： | 表面贴装技术(SMT) 贴装设备 BGA器件 组装技术 |
| 文章编号： | 1004-4507(2005)10-0048-04 |
| 收稿时间： | 09 24 2005 12:00AM |
| 修稿时间： | 2005年9月24日 |
The BGAs to Affect SMT Placement Equipment |
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| HU Zhi-yong.The BGAs to Affect SMT Placement Equipment[J].Equipment for Electronic Products Marufacturing,2005,34(10):48-51. |
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| Authors: | HU Zhi-yong |
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| Institution: | East-China Institute of Computer Technology, Shanghai 201800 |
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| Abstract: | The emergence of BGA technology has forced manufacturers to take a new look at their assembly processes. The capability for accurate placement will continue to be important as chip scale packages and flip chip technology reduce pin pitches even further in the unending race for product miniaturization. |
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| Keywords: | SMT Placement Equipment BGAs Packaging technology |
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