| 复合材料固化过程中温度及应变场分布的解析解 |
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| 引用本文： | 李君,姚学锋,刘应华,寇哲君,戴棣.复合材料固化过程中温度及应变场分布的解析解[J].清华大学学报(自然科学版),2009(5). |
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| 作者姓名： | 李君 姚学锋 刘应华 寇哲君 戴棣 |
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| 作者单位： | 清华大学工程力学系;北京航空制造工程研究所; |
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| 基金项目： | 国家自然科学基金资助项目(10772094) |
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| 摘 要： | 针对复合材料层合板结构件的制造工艺过程,建立简化的一维层合板结构件的瞬态热传导方程;基于典型的固化工艺曲线,推导出复合材料层合板结构件固化过程中的温度场分布函数,并建立固化过程中的过余温度和Biot数以及Fourier数的关系;绘制出层合板结构件厚度方向在典型固化工艺方案下中心线上过余温度场的分布图,然后基于温度场分布计算出层合板结构件在固化过程中导致的内部应变场分布。研究表明:在升(降)阶段,中心温度和边界温度相差不大;在保温阶段,结构件内部温度出现显著的滞后现象。
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| 关 键 词： | 固化 瞬态热传导 过余温度 |
Temperature fields and strains in composite laminates during curing |
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| LI Jun,YAO Xuefeng,LIU Yinghua,KOU Zhejun,DAI Di.Temperature fields and strains in composite laminates during curing[J].Journal of Tsinghua University(Science and Technology),2009(5). |
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| Authors: | LI Jun YAO Xuefeng LIU Yinghua KOU Zhejun DAI Di |
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| Institution: | 1.Department of Engineering Mechanics;Tsinghua University;Beijing 100084;China;2.Beijing Aeronautical Manufacturing Technology Research Institute;Beijing 100024;China |
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| Abstract: | The curing of a composite laminate was modeled using a simplified one-dimensional transient heat conduction model.An analytical solution was derived for the temperature response of the composite laminate structure for typical curing conditions.The result relates the surplus temperature,the Biot number,and the Fourier number in a chart for the midplane of the part during the temperature holding and ramp stages.The strain field is then calculated from the temperature field.The results show that the maximum in... |
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| Keywords: | curing transient heat conduction surplus temperature |
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