硫酸盐体系三价铬沉积机理及镀层表征

在新研发的硫酸盐三价铬镀厚铬的镀液体系中, 运用线性扫描伏安法(LSV)和循环伏安法(CV)对三价铬在铜电极表面的电沉积过程进行研究, 并运用X射线荧光测厚仪、扫描电子显微镜(SEM)、X射线能量色散谱(EDS)、X射线衍射仪(XRD)、显微硬度计和Tafel曲线表征铬镀层厚度、形貌、组成、结构、显微硬度及在3.5wt% NaCl溶液中的耐蚀性. 结果表明, 在该体系中三价铬的沉积过程分两步进行(Cr³⁺ + e →Cr²⁺ , Cr²⁺ + 2e → Cr), 第一步得到1个电子, 受电化学过程和扩散过程共同控制, 第二步得到2个电子, 为扩散控制下的不可逆过程; 该镀层为瘤状纳米晶结构, 镀层中含有少量的铁元素(1.10 wt%), 显微硬度达到789.2 Hv, 镀层在3.5wt% NaCl溶液中的腐蚀电位(E_corr)为-0.29 V, 腐蚀电流密度(j_corr)为9.26×10^-5 A·dm^-2.

Deposition Mechanism and Coating Characterization for the Trivalent Chromium Electrodeposition in Sulphate Electrolyte

Linear sweep voltammetry (LSV) and cyclic voltammetry (CV) were used to study the electrodeposition mechanism of trivalent chromium on a copper electrode in the novel sulphate electrolyte for thick trivalent chromium plating. The thickness, morphology, composition, microhardness, and structure, as well as the corrosion resistance in 3.5wt% NaCl solution of the trivalent chromium coatings were investigated by X-ray fluorescence gage, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), microhardness tester, X-ray diffraction (XRD) and Tafel curve measurements. The results showed that the electrodeposition of trivalent chromium involved two consecutive one electron reduction steps. The first step,Cr³⁺ + e →Cr²⁺,is controlled by the electrochemical reduction and diffusion processes, and the second step,Cr²⁺ + 2e → Cr, is an irreversible process under the diffusion control. The trivalent chromium coating exhibited nodular nanocrystalline structure and contained a small amount of iron (1.10wt%). The microhardness of the coating reached to 789.2 Hv. The corrosion potential (E_corr) and corrosion current density (j_corr) of the coating in 3.5wt% NaCl solution were determined to be -0.29 V and 9.26×10^-5 A·dm^-2, respectively.